Grant: Collaborative Research and Development Grants
Université de Sherbrooke
$195,652.00
Virtual qualification methodologies for microelectronic packaging
FY 2016-17
Summary
The principal objective of the proposed research project is to demonstrate a complete virtual qualification (VQ) platform applied to the complex engineering problems encountered during the development and manufacturing of advanced microelectronic components at IBM (the industrial partner). The term ""virtual qualification"" here specifically means the process by which all relevant failure mechanisms and manufacturing defects are simulated numerically, in order to compute a probability of failure for a new technology, process or design. The most important element of novelty in the proposed research is the completeness of the VQ process to be developed, in the sense that it has sufficient breadth and quantitatively demonstrated credibility to be used on a regular basis by the industrial partner to replace expensive hardware-based experimental validations of new technologies by highly-efficient VQ. The proposed research project will develop both the new methodologies to implement VQ at IBM, as well as the full library of advanced numerical models used to simulate the thermal and mechanical loads on microelectronic components. The success of the project will be measured in terms of gains in competitiveness for our industrial partner, for instance in terms of reduced time-to-market or lower development costs. While some of the VQ tools will be developed specifically for the microelectronic components built by IBM, most of the methodologies and software to be created in this research project will be broadly applicable to other fields where complex numerical simulations are used to validate critical design choices.
Program
Collaborative Research and Development Grants
Recipient
Location
Quebec, Canada
Recipient Type
Academia
Type
Grant
Source
NSERC's Awards Data
As published
Application id
491916-2015
Name nom
Sylvestre, Julien
Department département
Génie mécanique
Organization id
68
Institution établissement
Université de Sherbrooke
Province en
Québec
Province fr
Québec
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2016
Competition year année de concours
2015
Award amount
195652
Program id
CRDPJ
Program name en
Collaborative Research and Development Grants
Program name fr
Subventions de recherche et développement coopérative
Group en
Research partnerships programs
Group fr
Programmes de partenariat
Committee code
96
Committee name en
RPP Internal Decision Cttee
Committee name fr
Cté de décision interne - PPR
Area of application code
513
Area of application group en
Manufacturing processes and products
Area of application group fr
Procédés et produits industriels
Area of application en
Electrical and electronic machinery and equipment (including computer hardware)
Area of application fr
Machinerie et équipement électriques et électroniques (y compris matériel informatique)
Research subject code
2523
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Semiconductor fabrication and packaging
Research subject fr
Fabrication et mise sous enveloppe de semi-conducteurs
Partie
1
Nb partie
3
Application title
Virtual qualification methodologies for microelectronic packaging
Keyword
NSERC
Application summary
The principal objective of the proposed research project is to demonstrate a complete virtual qualification (VQ) platform applied to the complex engineering problems encountered during the development and manufacturing of advanced microelectronic components at IBM (the industrial partner). The term ""virtual qualification"" here specifically means the process by which all relevant failure mechanisms and manufacturing defects are simulated numerically, in order to compute a probability of failure for a new technology, process or design. The most important element of novelty in the proposed research is the completeness of the VQ process to be developed, in the sense that it has sufficient breadth and quantitatively demonstrated credibility to be used on a regular basis by the industrial partner to replace expensive hardware-based experimental validations of new technologies by highly-efficient VQ. The proposed research project will develop both the new methodologies to implement VQ at IBM, as well as the full library of advanced numerical models used to simulate the thermal and mechanical loads on microelectronic components. The success of the project will be measured in terms of gains in competitiveness for our industrial partner, for instance in terms of reduced time-to-market or lower development costs. While some of the VQ tools will be developed specifically for the microelectronic components built by IBM, most of the methodologies and software to be created in this research project will be broadly applicable to other fields where complex numerical simulations are used to validate critical design choices.