Grant: Idea to Innovation
Université du Québec à Montréal
$124,000.00
A novel polymeric platform based on functional polynorbornenes: from adhesives to fibers
FY 2015-16
Summary
Epoxy resins are ubiquitous: from composite airplane structures to wood structures, from electronic components to 3D-printing resins. Most epoxy resins are based on two components, an epoxidated bisphenol moiety (so called epoxy monomer) and a hardener which are heated together to yield a very hard epoxy matrix. Despite the fact that bisphenols are closely scrutinized due to their perceived or real harmful properties for the environment, and despite the fact that the synthesis of such bisphenol requires highly toxic chemicals, little effort has been made to replace current epoxy resins by a green alternative. Furthermore, bisphenol based epoxy resins have usually glass temperatures (Tg) below 200 oC, whereas higher Tg are highly desirable for a range of applications, notably in the aeronautical and electronic domain.
We have developed a novel epoxy platform which is devoid of bisphenol, and which leads to reasins with Tg as high as 350 oC. Furthermore, the epoxy monomer is prepared with green chemistry concepts (no harmful chemicals) and biobased hardeners such as glycerol can be used to lead to the resin. Thus this resin not only offers superior thermal properties to most existing epoxy resins, but it is also more acceptable in terms of environmental sustainability. Moreover we envision that these resins, if produced at a large scale, be economically competitive. However, in order to ascertain the production cost of these resins, we must optimize their production process, and this is the first goal of this proposal. Additionally, in order to attract industrial partners, we need to give them access to fully formulated products. Therefore, another goal of this proposal is to prepare formulated epoxy resins (ie containing the epoxy and numerous additives chosen in function of the precise application in mind). Thus formulated epoxy targeted for the domains of electronic encapsulation, high-performance coating, fibers and structural adhesives will be prepared at a scale of approx 1 kg, and distributed to potential customers for this novel technology.
Program
Idea to Innovation
Recipient
Location
Quebec, Canada
Recipient Type
Academia
Type
Grant
Source
NSERC's Awards Data
As published
Application id
476912-2015
Name nom
Claverie, Jerome
Department département
Chimie
Organization id
57
Institution établissement
Université du Québec à Montréal
Province en
Québec
Province fr
Québec
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2015
Competition year année de concours
2015
Award amount
124000
Program id
I2IPJ
Program name en
Idea to Innovation
Program name fr
De l'idée à l'innovation
Group en
Research partnerships programs
Group fr
Programmes de partenariat
Committee code
96
Committee name en
RPP Internal Decision Cttee
Committee name fr
Cté de décision interne - PPR
Area of application code
508
Area of application group en
Manufacturing processes and products
Area of application group fr
Procédés et produits industriels
Area of application en
Polymers, rubber and plastics
Area of application fr
Polymères, caoutchouc et plastiques
Research subject code
3751
Research subject group en
Polymer chemistry
Research subject group fr
Chimie des polymères
Research subject en
Polymer synthesis
Research subject fr
Synthèse des polymères
Partie
1
Nb partie
1
Application title
A novel polymeric platform based on functional polynorbornenes: from adhesives to fibers
Keyword
NSERC
Application summary
Epoxy resins are ubiquitous: from composite airplane structures to wood structures, from electronic components to 3D-printing resins. Most epoxy resins are based on two components, an epoxidated bisphenol moiety (so called epoxy monomer) and a hardener which are heated together to yield a very hard epoxy matrix. Despite the fact that bisphenols are closely scrutinized due to their perceived or real harmful properties for the environment, and despite the fact that the synthesis of such bisphenol requires highly toxic chemicals, little effort has been made to replace current epoxy resins by a green alternative. Furthermore, bisphenol based epoxy resins have usually glass temperatures (Tg) below 200 oC, whereas higher Tg are highly desirable for a range of applications, notably in the aeronautical and electronic domain.
We have developed a novel epoxy platform which is devoid of bisphenol, and which leads to reasins with Tg as high as 350 oC. Furthermore, the epoxy monomer is prepared with green chemistry concepts (no harmful chemicals) and biobased hardeners such as glycerol can be used to lead to the resin. Thus this resin not only offers superior thermal properties to most existing epoxy resins, but it is also more acceptable in terms of environmental sustainability. Moreover we envision that these resins, if produced at a large scale, be economically competitive. However, in order to ascertain the production cost of these resins, we must optimize their production process, and this is the first goal of this proposal. Additionally, in order to attract industrial partners, we need to give them access to fully formulated products. Therefore, another goal of this proposal is to prepare formulated epoxy resins (ie containing the epoxy and numerous additives chosen in function of the precise application in mind). Thus formulated epoxy targeted for the domains of electronic encapsulation, high-performance coating, fibers and structural adhesives will be prepared at a scale of approx 1 kg, and distributed to potential customers for this novel technology.
