Grant: Discovery Grants Program - Individual
Dalhousie University
$48,000.00
Design techniques for three-dimensional integrated circuits challenges
FY 2021-22
Summary
3D-IC; analog integrated circuits; calibration; clock skew; CMOS; crosstalk; IC stacking; low power; mixed-signal integrated circuits; Through silicon via (TSV)
Program
Discovery Grants Program - Individual
Recipient
Location
Nova Scotia, Canada
Recipient Type
Academia
Type
Grant
Source
NSERC's Awards Data
As published
Application id
RGPIN-2017-04292
Name nom
El-Sankary, Kamal
Department département
Electrical & Computer Engineering
Organization id
79
Institution établissement
Dalhousie University
Province en
Nova Scotia
Province fr
Nouvelle-Écosse
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2021
Competition year année de concours
2017
Award amount
48000
Program id
RGPIN
Program name en
Discovery Grants Program - Individual
Program name fr
Programme de subventions à la découverte - individuelles
Group en
Discovery grants programs
Group fr
Programmes de subventions à la découverte
Committee code
1510
Committee name en
Electrical and Computer Engineering
Committee name fr
Génie électrique et informatique
Area of application code
513
Area of application group en
Manufacturing processes and products
Area of application group fr
Procédés et produits industriels
Area of application en
Electrical and electronic machinery and equipment (including computer hardware)
Area of application fr
Machinerie et équipement électriques et électroniques (y compris matériel informatique)
Research subject code
2504
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Integrated circuits
Research subject fr
Circuits intégrés
Installment
inst:5; 6
Partie
2
Nb partie
6
Application title
Design techniques for three-dimensional integrated circuits challenges
Keyword
NSERC
Application summary
3D-IC; analog integrated circuits; calibration; clock skew; CMOS; crosstalk; IC stacking; low power; mixed-signal integrated circuits; Through silicon via (TSV)
