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Grant: Collaborative Research and Development Grants

École de technologie supérieure

$159,586.00

Configurable Integrated Power Input/Output Systems for Avionic Applications

FY 2021-22

Summary
Thales Canada's develops control systems for avionics applications, which operate in harsh environments that may compromise the functionality of very high density chips: electromagnetic interference, lightning strikes and cosmic radiations. The company needs to develop a generic power interface for different avionics applications with a high level of criticality : flight control, spoilers control, flaps control. However, such circuitry requires a lot of space on PCBs when implemented as discrete components, such as in the company's existing products. A reasonable trade-off between ASICs and discrete components is the concept of System in Package (SiP). SiP allows more than one integrated circuit inside the same package with very dense interconnects between bare-dies. Also, SiP technology now allows chips of heterogeneous technologies to be integrated inside the same package, giving designers more flexibility. Heterogeneous integration of high power and high voltage systems along with lower power systems through SiP technologies in a high reliability context suited to avionics is the focus of this collaborative research project. While ASIC are an attractive solution, robustness problems, such as dielectric breakdown, may emerge when considering high voltage inputs. Ultimately, SiP integration of the entire power system would be a significant reduction in the PCB dimensions for the power circuits and potentially enhanced functionality. Accordingly, the main objective of the research project is to elaborate methods and techniques to design compact, configurable and integrated input/output power systems for transportation vehicles under harsh conditions. A collection of highly flexible and reconfigurable elements to support a plurality of monitoring and controlling functions for power systems will be investigated. These methods and techniques will allow integrating these heterogeneous elements into a minimum set of SiP modules. Upon successful completion of this research, a new flexible power system will be configurable according to different specifications in terms of power, response time and accuracy that are required in the avionics industries.
Program
Collaborative Research and Development Grants
Location
Quebec, Canada
Recipient Type
Academia
Type
Grant
Source
NSERC's Awards Data

As published

Application id
518245-2017
Name nom
Blaquière, Yves
Department département
Génie électrique
Organization id
53
Institution établissement
École de technologie supérieure
Province en
Québec
Province fr
Québec
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2021
Competition year année de concours
2017
Award amount
159586
Program id
CRDPJ
Program name en
Collaborative Research and Development Grants
Program name fr
Subventions de recherche et développement coopérative
Group en
Research partnerships programs
Group fr
Programmes de partenariat
Committee code
96
Committee name en
RPP Internal Decision Cttee
Committee name fr
Cté de décision interne - PPR
Area of application code
1207
Area of application group en
Advancement of knowledge
Area of application group fr
Avancement des connaissances
Area of application en
Information, computer and communication technologies
Area of application fr
Technologie de l'information, des ordinateurs et des réseaux de communications
Research subject code
2504
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Integrated circuits
Research subject fr
Circuits intégrés
Installment
inst:4
Partie
1
Nb partie
4
Application title
Configurable Integrated Power Input/Output Systems for Avionic Applications
Keyword
NSERC
Application summary
Thales Canada's develops control systems for avionics applications, which operate in harsh environments that may compromise the functionality of very high density chips: electromagnetic interference, lightning strikes and cosmic radiations. The company needs to develop a generic power interface for different avionics applications with a high level of criticality : flight control, spoilers control, flaps control. However, such circuitry requires a lot of space on PCBs when implemented as discrete components, such as in the company's existing products. A reasonable trade-off between ASICs and discrete components is the concept of System in Package (SiP). SiP allows more than one integrated circuit inside the same package with very dense interconnects between bare-dies. Also, SiP technology now allows chips of heterogeneous technologies to be integrated inside the same package, giving designers more flexibility. Heterogeneous integration of high power and high voltage systems along with lower power systems through SiP technologies in a high reliability context suited to avionics is the focus of this collaborative research project. While ASIC are an attractive solution, robustness problems, such as dielectric breakdown, may emerge when considering high voltage inputs. Ultimately, SiP integration of the entire power system would be a significant reduction in the PCB dimensions for the power circuits and potentially enhanced functionality. Accordingly, the main objective of the research project is to elaborate methods and techniques to design compact, configurable and integrated input/output power systems for transportation vehicles under harsh conditions. A collection of highly flexible and reconfigurable elements to support a plurality of monitoring and controlling functions for power systems will be investigated. These methods and techniques will allow integrating these heterogeneous elements into a minimum set of SiP modules. Upon successful completion of this research, a new flexible power system will be configurable according to different specifications in terms of power, response time and accuracy that are required in the avionics industries.