Grant: Strategic Projects - Group
Institut national de la recherche scientifique
$198,000.00
Physical vapour deposition of ferroelectric and multiferroic tunnel junctions
FY 2019-20
Summary
Ferroelectric tunnel junctions (FTJs) are the strongest contender to replace flash memory in integrated computer circuitry as they combine low-cost, non-volatility, small footprint, fast read- write cycles, low energy consumption, non-destructive readout and, since very recently, cmos-compatibility. The principle of operation is based on resistive switching between two conductive states that, in the case of FTJs are provided through the distinct state of spontaneous polarization. Intrinsically only a few unit cells thick, they are also suited for integration in crossbar arrays to combine features of memory and logic thus enabling innovative circuit architectures with tremendous potential for energy savings during processor operation. We have very recently demonstrated FTJs with proven CMOS compatibility, using only materials, HfZrO2, that are already part of cmos processing and keeping all process parameters, in particular the deposition temperature, within tolerances. With the proof of concept submitted for patent in collaboration with the industrial partner, the further development of these electronic functions relies for one on the optimization of process parameters for RF magnetron sputtering, a process to be readily adopted from laboratory to fabrication scale. For the other, parasitic switching effects, such as filamentary-mediated resistive switching need to be excluded and the most common failure mechanisms, e.g. point defects, will have to be identified. For this purpose, we collaborate with the electron microscopy and spectroscopy (PEEM) beam line at the Canadian Light Source, Canada's most advanced infrastructure for nanoscale chemical and structural imaging. In order to determine the full potential of these electronic tiles for given specifications (mainly the resistance ratio between on and off state), we collaborate with the NSERC/IBM Canadian industrial research chair to guide the integration towards the most promising circuit architecture. The main objective of this partnership is to develop an industrial main-frame compatible process for a novel non-volatile memory generation to outperform flash in terms of write speed, energy consumption and endurance.
Program
Strategic Projects - Group
Location
Quebec, Canada
Recipient Type
Academia
Type
Grant
Source
NSERC's Awards Data
As published
Application id
506953-2017
Name nom
Ruediger, Andreas
Department département
Énergie Matériaux Télécommunications, Centre - Varennes
Organization id
56
Institution établissement
Institut national de la recherche scientifique
Province en
Québec
Province fr
Québec
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2019
Competition year année de concours
2017
Award amount
198000
Program id
STPGP
Program name en
Strategic Projects - Group
Program name fr
Projets stratégiques - De groupe
Group en
RESEARCH PARTNERSHIPS
Group fr
PARTENARIATS DE RECHERCHE
Committee code
1586
Committee name en
Strategic Projects - Advanced Manufacturing
Committee name fr
Projets stratégiques - Fabrication de pointe
Area of application code
802
Area of application group en
Information and communication services
Area of application group fr
Services d'information et de télécommunications
Area of application en
Information systems and technology
Area of application fr
Systèmes d'information et technologie de l'information
Research subject code
2010
Research subject group en
Materials science and technology
Research subject group fr
Science et technologie des matériaux
Research subject en
Thin films/interface
Research subject fr
Films minces et interfaces
Installment
inst:3 - 3
Partie
3
Nb partie
3
Application title
Physical vapour deposition of ferroelectric and multiferroic tunnel junctions
Keyword
NSERC
Application summary
Ferroelectric tunnel junctions (FTJs) are the strongest contender to replace flash memory in integrated computer circuitry as they combine low-cost, non-volatility, small footprint, fast read- write cycles, low energy consumption, non-destructive readout and, since very recently, cmos-compatibility. The principle of operation is based on resistive switching between two conductive states that, in the case of FTJs are provided through the distinct state of spontaneous polarization. Intrinsically only a few unit cells thick, they are also suited for integration in crossbar arrays to combine features of memory and logic thus enabling innovative circuit architectures with tremendous potential for energy savings during processor operation. We have very recently demonstrated FTJs with proven CMOS compatibility, using only materials, HfZrO2, that are already part of cmos processing and keeping all process parameters, in particular the deposition temperature, within tolerances. With the proof of concept submitted for patent in collaboration with the industrial partner, the further development of these electronic functions relies for one on the optimization of process parameters for RF magnetron sputtering, a process to be readily adopted from laboratory to fabrication scale. For the other, parasitic switching effects, such as filamentary-mediated resistive switching need to be excluded and the most common failure mechanisms, e.g. point defects, will have to be identified. For this purpose, we collaborate with the electron microscopy and spectroscopy (PEEM) beam line at the Canadian Light Source, Canada's most advanced infrastructure for nanoscale chemical and structural imaging. In order to determine the full potential of these electronic tiles for given specifications (mainly the resistance ratio between on and off state), we collaborate with the NSERC/IBM Canadian industrial research chair to guide the integration towards the most promising circuit architecture. The main objective of this partnership is to develop an industrial main-frame compatible process for a novel non-volatile memory generation to outperform flash in terms of write speed, energy consumption and endurance.