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Grant: Collaborative Research and Development Grants

Université de Sherbrooke

$255,000.00

Integration technologies for immersion cooling in microelectronics

FY 2020-21

Summary
The proposed project is a research collaboration between the Université de Sherbrooke (UdeS), Systemex Energy inc. and Varitron Technologies inc., to develop a new type of highly efficient cooling technology for advanced electronic devices. This cooling technology is based on immersing the semiconductor device into a dielectric liquid, to benefit from its vaporization phase change to carry heat away from the device efficiently. This approach has been studied before, in relatively simple implementations which clearly demonstrates its impressive thermal performances. However, immersion cooling has not yet reached its full potential because of two technological issues, both related to an incomplete scientific understanding of the phenomena involved in immersion cooling. The first issue is the so-called boiling crisis, a complex phenomenon involving the flux of heat, liquid and vapor which limits the thermal performances and create stability issues. The second issue is the reliability risk created by immersing electronic components which have not been designed for this purpose, and which might be subjected to new failure mechanisms because of immersion. Here, we propose to study at a fundamental level both the boiling crisis and the reliability risk, to develop precisely engineered immersion hardware which can be rigorously shown to be efficient, stable and reliable. The project will used advanced experimental techniques and simulation methods to contribute to the scientific understanding of cooling by boiling. The cooling technology will be developed and tested on industrial-scale manufacturing equipment at C2MI, so it can be produced cost-effectively in a well integrated packaging process, with an eventual expedited transfer of the new technology to the industry. The kinetics of failure mechanisms will be measured experimentally, and will be interpreted with respect to chemical interactions and thermomechanical phenomena in the immersed hardware. _x000d_Le projet de recherche proposé est une collaboration entre l'Université de Sherbrooke, Systemex Energy inc. et Varitron Technologies inc., dont le but est de développer une nouvelle technologie de refroidissement à haute capacité pour des dispositifs élec
Program
Collaborative Research and Development Grants
Location
Quebec, Canada
Recipient Type
Academia
Type
Grant
Source
NSERC's Awards Data

As published

Application id
513262-2017
Name nom
Sylvestre, Julien
Department département
Génie mécanique
Organization id
68
Institution établissement
Université de Sherbrooke
Province en
Québec
Province fr
Québec
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2020
Competition year année de concours
2017
Award amount
255000
Program id
CRDPJ
Program name en
Collaborative Research and Development Grants
Program name fr
Subventions de recherche et développement coopérative
Group en
Research partnerships programs
Group fr
Programmes de partenariat
Committee code
141
Committee name en
University/Industry
Committee name fr
Universités/industrie
Area of application code
513
Area of application group en
Manufacturing processes and products
Area of application group fr
Procédés et produits industriels
Area of application en
Electrical and electronic machinery and equipment (including computer hardware)
Area of application fr
Machinerie et équipement électriques et électroniques (y compris matériel informatique)
Research subject code
2519
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Microelectronics
Research subject fr
Microélectronique
Installment
inst:3 - 3
Partie
1
Nb partie
3
Application title
Integration technologies for immersion cooling in microelectronics
Keyword
NSERC
Application summary
The proposed project is a research collaboration between the Université de Sherbrooke (UdeS), Systemex Energy inc. and Varitron Technologies inc., to develop a new type of highly efficient cooling technology for advanced electronic devices. This cooling technology is based on immersing the semiconductor device into a dielectric liquid, to benefit from its vaporization phase change to carry heat away from the device efficiently. This approach has been studied before, in relatively simple implementations which clearly demonstrates its impressive thermal performances. However, immersion cooling has not yet reached its full potential because of two technological issues, both related to an incomplete scientific understanding of the phenomena involved in immersion cooling. The first issue is the so-called boiling crisis, a complex phenomenon involving the flux of heat, liquid and vapor which limits the thermal performances and create stability issues. The second issue is the reliability risk created by immersing electronic components which have not been designed for this purpose, and which might be subjected to new failure mechanisms because of immersion. Here, we propose to study at a fundamental level both the boiling crisis and the reliability risk, to develop precisely engineered immersion hardware which can be rigorously shown to be efficient, stable and reliable. The project will used advanced experimental techniques and simulation methods to contribute to the scientific understanding of cooling by boiling. The cooling technology will be developed and tested on industrial-scale manufacturing equipment at C2MI, so it can be produced cost-effectively in a well integrated packaging process, with an eventual expedited transfer of the new technology to the industry. The kinetics of failure mechanisms will be measured experimentally, and will be interpreted with respect to chemical interactions and thermomechanical phenomena in the immersed hardware. _x000d_Le projet de recherche proposé est une collaboration entre l'Université de Sherbrooke, Systemex Energy inc. et Varitron Technologies inc., dont le but est de développer une nouvelle technologie de refroidissement à haute capacité pour des dispositifs élec
Université de Sherbrooke - $255,000 Grant (2020-21) | Canada Spends