Grant: Alliance Grants
Université de Sherbrooke
$408,000.00
LASERS: Leveraging advanced substrate epitaxy for reusable optoelectronics substrates
FY 2024-25
Summary
Laser diodes are essential components across a wide array of industries, including medicine, industry, telecommunications, transportation, environment, and defense. However, their efficacy is often hampered by limitations inherent in traditional substrate materials and fabrication methods.
To address these challenges, a collaborative effort has been proposed, leveraging the innovative PEELER technique developed by the Université de Sherbrooke. This groundbreaking approach enables the fabrication of high-performance laser diodes through the use of reusable parent substrates, promising enhanced yield and reduced manufacturing costs.
The partnership comprises Laser Components Canada (LCC), a specialist in high-power laser diodes, Umicore, a world leader in advanced substrate production and recycling, and Université de Sherbrooke, renowned for its expertise in substrate engineering and micro/nanofabrication.
The overarching goals of this collaboration are multifaceted: Firstly, developing a novel semiconductor device manufacturing process aims to alleviate Canada's reliance on fluctuating global wafer supply chains, thereby bolstering the domestic semiconductor industry. Secondly, by creating key process building blocks for low-cost, high-performance laser diodes, the partnership seeks to establish a new industry standard, positioning Canada and Quebec as a leader in laser diode technology. Furthermore, advancements in the PEELER process are expected to enhance its efficiency and versatility, facilitating easy integration of laser diodes into Silicon. Finally, the initiative also aims to mitigate the environmental footprint of semiconductor manufacturing by reducing dependency on rare materials and minimizing waste by re-using them multiple times.
Program
Alliance Grants
Recipient
Location
Quebec, Canada
Recipient Type
Academia
Type
Grant
Source
NSERC's Awards Data
As published
Application id
592557-2023
Name nom
Boucherif, Abderraouf A
Department département
Génie mécanique
Organization id
68
Institution établissement
Université de Sherbrooke
Province en
Québec
Province fr
Québec
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2024
Competition year année de concours
2023
Award amount
408000
Program id
ALLRP
Program name en
Alliance Grants
Program name fr
Subventions Alliance
Group en
RESEARCH PARTNERSHIPS
Group fr
PARTENARIATS DE RECHERCHE
Committee code
96
Committee name en
RPP Internal Decision Cttee
Committee name fr
Cté de décision interne - PPR
Area of application code
1207
Area of application group en
Advancement of knowledge
Area of application group fr
Avancement des connaissances
Area of application en
Information, computer and communication technologies
Area of application fr
Technologie de l'information, des ordinateurs et des réseaux de communications
Research subject code
2515
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Electronic materials and components
Research subject fr
Matériels et composants électroniques
Field of research list names en
Not available
Field of research list names fr
Non disponible
Socioeconomic objective list names en
Not available
Socioeconomic objective list names fr
Non disponible
Application title
LASERS: Leveraging advanced substrate epitaxy for reusable optoelectronics substrates
Keywords
electrochemical etching; epitaxial liftoff process; epitaxy; iii-v materials; lasers; materials characterization; photonics; porous semiconductors
Application summary
Laser diodes are essential components across a wide array of industries, including medicine, industry, telecommunications, transportation, environment, and defense. However, their efficacy is often hampered by limitations inherent in traditional substrate materials and fabrication methods.
To address these challenges, a collaborative effort has been proposed, leveraging the innovative PEELER technique developed by the Université de Sherbrooke. This groundbreaking approach enables the fabrication of high-performance laser diodes through the use of reusable parent substrates, promising enhanced yield and reduced manufacturing costs.
The partnership comprises Laser Components Canada (LCC), a specialist in high-power laser diodes, Umicore, a world leader in advanced substrate production and recycling, and Université de Sherbrooke, renowned for its expertise in substrate engineering and micro/nanofabrication.
The overarching goals of this collaboration are multifaceted: Firstly, developing a novel semiconductor device manufacturing process aims to alleviate Canada's reliance on fluctuating global wafer supply chains, thereby bolstering the domestic semiconductor industry. Secondly, by creating key process building blocks for low-cost, high-performance laser diodes, the partnership seeks to establish a new industry standard, positioning Canada and Quebec as a leader in laser diode technology. Furthermore, advancements in the PEELER process are expected to enhance its efficiency and versatility, facilitating easy integration of laser diodes into Silicon. Finally, the initiative also aims to mitigate the environmental footprint of semiconductor manufacturing by reducing dependency on rare materials and minimizing waste by re-using them multiple times.