Grant: Research Tools and Instruments - Category 1 (<$150,000)

In this application, we request funding for assembly and test equipment to support a variety of microsystem applications including communications, silicon electronic-photonic integrated circuits, biomedical and sensory applications. Globally, we are on the cusp of revolutionary changes in communication and microsystem technology through the combination of two or more of micro-electro-mechanical structures (MEMS) sensors, photonics, i.e, manipulation of information using light, or photons, and electronics, i.e., information processing using electrical signals, on a single platform (e.g., silicon). How is this relevant to society? We have witnessed that the concept of integration is exceedingly important in the success of numerous products. For example, sensory systems through integration of sensors and electronics have revolutionized many fields including wireless sensor networks (e.g., autonomous sensors to monitor physical or environmental conditions), and biomedical implants that sense and monitor an internal activity at the implant site. As another example, smartphones have relatively small form factors and yet they are highly functional. The miniaturization of optical components onto silicon chips (""silicon photonics"") will enable tremendous developments akin to communication systems including smartphones. Electronic-photonic circuits will play a ubiquitous role globally, impacting such areas as high-speed communications for mobile devices (smartphones, tablets), optical communications within computers and within data centres (e.g., Google), sensor systems, and medical applications. Our research programs emphasize on students designing leading-edge microsystems for far-reaching research- and industry-relevant applications. The requested wire-bonder (to bond integrated circuit dice to substrates such as printed circuit boards, packages, or other samples such as micro-electro-mechanical sensors (MEMS)), probe station system (for on-die and on-wafer radio-frequency (RF) and microwave measurements), and signal and spectrum analyzer are essential for assembly, testing and characterizing such microsystems.