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Grant: Engage Plus Grants Program

École de technologie supérieure

$12,500.00

Microelectromechanical Low-power Strain Sensor for Structural Health Monitoring Applications

FY 2017-18

Summary
Strain sensors suited for the structural health monitoring (SHM) of airplanes are often not miniaturised orrequire significant amounts of power, leading to difficulties in accessing constrained locations, prohibitivelyheavy cabling, and frequent and expensive battery maintenance. Microelectromechanical systems (MEMS) canreduce the size and power consumption of these sensors. However, the associated sensing electronics requiresignificant amounts of power to condition the analog signals from the MEMS transducer.To resolve this, IPR inc. is proposing a digital-output MEMS transducer design, along with the monitoringlow-power electronics, that is tailored for SHM of airplanes in a compact form-factor and low-power signalingscheme. IPR's MEMS transducer is based on a direct contact structure that allows for on/off type of detectionof a strain variation that moves a shuttle mass. This unique and effective solution will allow IPR to create anaffordable and power efficient strain sensing SHM system. However, the current solution has metmicro-fabrication yield issues and questions remain regarding its contact-based sensing scheme. This requiresthe current strain transducer design to be revisited and its implementation in a stable and robust commercialMEMS fabrication process. IPR wants to continue its collaboration with Prof. Frederic Nabki at ETS throughthis Engage Plus project to refine the MEMS strain sensor design proposed in the previous Engage project andcharacterise the initial prototypes fabricated. This transducer will later be integrated within IPR's customlow-power interface electronics to implement a complete strain sensing system for SHM.This project is a key building block of IPR's low-power and compact strain sensor, and will be a springboardtowards a leadership market position. The innovative MEMS device resulting from this project will ultimatelyenable the implementation of novel network of sensors well-suited to various traditionally inaccessibleenvironments. This project will provide training for HQP (one research professional, one master's student an
Program
Engage Plus Grants Program
Location
Quebec, Canada
Recipient Type
Academia
Type
Grant
Source
NSERC's Awards Data

As published

Application id
520540-2017
Name nom
Nabki, Frederic
Department département
Génie électrique
Organization id
53
Institution établissement
École de technologie supérieure
Province en
Québec
Province fr
Québec
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2017
Competition year année de concours
2017
Award amount
12500
Program id
EGP2
Program name en
Engage Plus Grants Program
Program name fr
Programme de subvention d'engagement partenarial Plus
Group en
Research partnerships programs
Group fr
Programmes de partenariat
Committee code
1552
Committee name en
Quebec Internal Decision Committee
Committee name fr
Comité de décision interne pour le Québec
Area of application code
703
Area of application group en
Transportation systems and services
Area of application group fr
Services et systèmes de transport
Area of application en
Aerospace
Area of application fr
Aérospatial
Research subject code
2506
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Electron devices
Research subject fr
Dispositifs électroniques
Partie
1
Nb partie
1
Application title
Microelectromechanical Low-power Strain Sensor for Structural Health Monitoring Applications
Keyword
NSERC
Application summary
Strain sensors suited for the structural health monitoring (SHM) of airplanes are often not miniaturised orrequire significant amounts of power, leading to difficulties in accessing constrained locations, prohibitivelyheavy cabling, and frequent and expensive battery maintenance. Microelectromechanical systems (MEMS) canreduce the size and power consumption of these sensors. However, the associated sensing electronics requiresignificant amounts of power to condition the analog signals from the MEMS transducer.To resolve this, IPR inc. is proposing a digital-output MEMS transducer design, along with the monitoringlow-power electronics, that is tailored for SHM of airplanes in a compact form-factor and low-power signalingscheme. IPR's MEMS transducer is based on a direct contact structure that allows for on/off type of detectionof a strain variation that moves a shuttle mass. This unique and effective solution will allow IPR to create anaffordable and power efficient strain sensing SHM system. However, the current solution has metmicro-fabrication yield issues and questions remain regarding its contact-based sensing scheme. This requiresthe current strain transducer design to be revisited and its implementation in a stable and robust commercialMEMS fabrication process. IPR wants to continue its collaboration with Prof. Frederic Nabki at ETS throughthis Engage Plus project to refine the MEMS strain sensor design proposed in the previous Engage project andcharacterise the initial prototypes fabricated. This transducer will later be integrated within IPR's customlow-power interface electronics to implement a complete strain sensing system for SHM.This project is a key building block of IPR's low-power and compact strain sensor, and will be a springboardtowards a leadership market position. The innovative MEMS device resulting from this project will ultimatelyenable the implementation of novel network of sensors well-suited to various traditionally inaccessibleenvironments. This project will provide training for HQP (one research professional, one master's student an