Grant: Alliance Grants
Université de Sherbrooke
$345,700.00
Integration of a Bio-sourced epoxy for the reduction of BPA and petro-chemical agents in the microelectronics packaging eco-system
FY 2024-25
Summary
Sustainable development has justifiably witnessed a greater focus across Canada. In particular, the ever-accelerating pace of technology progress presents both the imperative and opportunity to replace current materials and chemical substances used in the electronics product supply chain with more environmentally friendly alternatives. Legislation regulating such materials has been established in Europe more than 15 years ago, notably REACH (Registration, Evaluation and Authorization of Chemicals), which is largely inspired by the chemicals found in the SVHC (Substance of Very High Concern) list published by ECHA (European Chemicals Agency) and used in most developed countries.
Epoxy resins are one such class of materials commonly employed in the packaging of electronic components. These materials are largely based on compounds derived from petroleum that are non-renewable and often have toxic (human and environmental), carcinogenic and mutagenic effects. To this end, bio-based epoxy resins represent a greener and less toxic alternative whose potential has been reported in a number of non-electronic applications. However, the stringent performance and reliability requirements of electronics products makes it especially difficult to formulate, adapt and garner acceptance of such material.
This project seeks to bring together Canadian experts across the entire supply chain, from raw materials thru formulation, end use and life cycle, in order to fully assess the viability and impact of bio-based epoxy resin compounds in microelectronic packaging and extend such learning to other areas of stringent use conditions.
Program
Alliance Grants
Recipient
Location
Quebec, Canada
Recipient Type
Academia
Type
Grant
Source
NSERC's Awards Data
As published
Application id
586753-2023
Name nom
Ecoffey, Serge S
Department département
Génie électrique et génie informatique
Organization id
68
Institution établissement
Université de Sherbrooke
Province en
Québec
Province fr
Québec
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2024
Competition year année de concours
2023
Award amount
345700
Program id
ALLRP
Program name en
Alliance Grants
Program name fr
Subventions Alliance
Group en
RESEARCH PARTNERSHIPS
Group fr
PARTENARIATS DE RECHERCHE
Committee code
96
Committee name en
RPP Internal Decision Cttee
Committee name fr
Cté de décision interne - PPR
Area of application code
1207
Area of application group en
Advancement of knowledge
Area of application group fr
Avancement des connaissances
Area of application en
Information, computer and communication technologies
Area of application fr
Technologie de l'information, des ordinateurs et des réseaux de communications
Research subject code
2519
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Microelectronics
Research subject fr
Microélectronique
Field of research list names en
Not available
Field of research list names fr
Non disponible
Socioeconomic objective list names en
Not available
Socioeconomic objective list names fr
Non disponible
Application title
Integration of a Bio-sourced epoxy for the reduction of BPA and petro-chemical agents in the microelectronics packaging eco-system
Keywords
advanced packaging; bio-sourced material; epoxy; life cycle analysis; microelectronic; polymer; recycling; societal impact
Application summary
Sustainable development has justifiably witnessed a greater focus across Canada. In particular, the ever-accelerating pace of technology progress presents both the imperative and opportunity to replace current materials and chemical substances used in the electronics product supply chain with more environmentally friendly alternatives. Legislation regulating such materials has been established in Europe more than 15 years ago, notably REACH (Registration, Evaluation and Authorization of Chemicals), which is largely inspired by the chemicals found in the SVHC (Substance of Very High Concern) list published by ECHA (European Chemicals Agency) and used in most developed countries.
Epoxy resins are one such class of materials commonly employed in the packaging of electronic components. These materials are largely based on compounds derived from petroleum that are non-renewable and often have toxic (human and environmental), carcinogenic and mutagenic effects. To this end, bio-based epoxy resins represent a greener and less toxic alternative whose potential has been reported in a number of non-electronic applications. However, the stringent performance and reliability requirements of electronics products makes it especially difficult to formulate, adapt and garner acceptance of such material.
This project seeks to bring together Canadian experts across the entire supply chain, from raw materials thru formulation, end use and life cycle, in order to fully assess the viability and impact of bio-based epoxy resin compounds in microelectronic packaging and extend such learning to other areas of stringent use conditions.