Grant: Research Tools and Instruments
Université de Sherbrooke
$150,000.00
3D microscopy from nanoelectronics devices to integrated systems
FY 2017-18
Summary
We request this grant to enable the acquisition of a confocal microscope for critical and timely morphological characterizations of quantum and nanoelectronic devices, micro-electro-mechanical-systems (MEMS), 2.5D and 3D microsystems, and smart microelectronic packages. This confocal microscope will not only provide us with 3D imagery with the increased XY plane resolution necessary for these applications and unavailable throughstandard optical microscopy, but more importantly permit height measurement in the Z direction with a resolution in the nm range. The requested tool has the following specifications: i) fast imagery of small to large surfaces (m2 to mm2); ii) 100 nm resolution in XY plane and nanometer scale resolution in Z direction; iii) in-process characterization capability; iv) topography measurements of transparent and reflective surfaces; and v) XY motorized stage with memories capability of automatic image stitching. The microscope will be used routinely for microfabrication process characterization and development, as well as material and device characterization. For heterogeneous integration and smart packaging, the microscope will be exploited for accurately assessing topologies and geometries of a large number of features on a given die or package such as interconnections, termination pads and through-silicon-vias (TSVs). For the fabrication of nanoelectronic devices, quantum qubits and emerging memories, the 3D microscope allows essential in-process monitoring of gate stack etching, junction engineering as well as intensive surface and 3D topographical characterization for device and material characterization. In MEMS, uniformity constraints over millimetre size regions are required for the moving elements which comprise sub-micron scale films across structures 100s of microns wide for which both local roughness and large scale deformations are relevant; the 3D confocal microscope will be a critical asset for the characterization of such features. The proposed 3D metrology system will not only enable an increased pace of research for the 6 professors that support this proposal but also open new opportunities within the 3IT academic and industrial ecosystem. The research community developed around the Quantum Institute, 3IT and C2MI allows the researchers to address larger scale projects spanning single device development through complete system integration. The proposed tool will support this trend by providing fast and accurate in-process metrology of complex systems. In addition, country-wide exploitation of the 3D confocal microscope will be available as a result of 3ITs participation in the CMC MNT Portal (~800 professors, ~7000 graduate students), which allows graduate students from other Canadian universities to be trained onsite and access 3IT equipment.
Program
Research Tools and Instruments
Recipient
Location
Quebec, Canada
Recipient Type
Academia
Type
Grant
Source
NSERC's Awards Data
As published
Application id
RTI-2018-00811
Name nom
Drouin, Dominique
Department département
Génie électrique et génie informatique - Génie électrique et génie informatique
Organization id
68
Institution établissement
Université de Sherbrooke
Province en
Québec
Province fr
Québec
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2017
Competition year année de concours
2018
Award amount
150000
Program id
RTI
Program name en
Research Tools and Instruments
Program name fr
Outils et instruments de recherche
Group en
Discovery grants programs
Group fr
Programmes de subventions à la découverte
Committee code
1610
Committee name en
Electrical and Computer Engineering (RTI)
Committee name fr
Génie électrique et infomatique (OIR)
Area of application code
1207
Area of application group en
Advancement of knowledge
Area of application group fr
Avancement des connaissances
Area of application en
Information, computer and communication technologies
Area of application fr
Technologie de l'information, des ordinateurs et des réseaux de communications
Research subject code
2009
Research subject group en
Materials science and technology
Research subject group fr
Science et technologie des matériaux
Research subject en
Semiconductors
Research subject fr
Semi-conducteurs
Partie
1
Nb partie
1
Application title
3D microscopy from nanoelectronics devices to integrated systems
Keyword
NSERC
Application summary
We request this grant to enable the acquisition of a confocal microscope for critical and timely morphological characterizations of quantum and nanoelectronic devices, micro-electro-mechanical-systems (MEMS), 2.5D and 3D microsystems, and smart microelectronic packages. This confocal microscope will not only provide us with 3D imagery with the increased XY plane resolution necessary for these applications and unavailable throughstandard optical microscopy, but more importantly permit height measurement in the Z direction with a resolution in the nm range. The requested tool has the following specifications: i) fast imagery of small to large surfaces (m2 to mm2); ii) 100 nm resolution in XY plane and nanometer scale resolution in Z direction; iii) in-process characterization capability; iv) topography measurements of transparent and reflective surfaces; and v) XY motorized stage with memories capability of automatic image stitching. The microscope will be used routinely for microfabrication process characterization and development, as well as material and device characterization. For heterogeneous integration and smart packaging, the microscope will be exploited for accurately assessing topologies and geometries of a large number of features on a given die or package such as interconnections, termination pads and through-silicon-vias (TSVs). For the fabrication of nanoelectronic devices, quantum qubits and emerging memories, the 3D microscope allows essential in-process monitoring of gate stack etching, junction engineering as well as intensive surface and 3D topographical characterization for device and material characterization. In MEMS, uniformity constraints over millimetre size regions are required for the moving elements which comprise sub-micron scale films across structures 100s of microns wide for which both local roughness and large scale deformations are relevant; the 3D confocal microscope will be a critical asset for the characterization of such features. The proposed 3D metrology system will not only enable an increased pace of research for the 6 professors that support this proposal but also open new opportunities within the 3IT academic and industrial ecosystem. The research community developed around the Quantum Institute, 3IT and C2MI allows the researchers to address larger scale projects spanning single device development through complete system integration. The proposed tool will support this trend by providing fast and accurate in-process metrology of complex systems. In addition, country-wide exploitation of the 3D confocal microscope will be available as a result of 3ITs participation in the CMC MNT Portal (~800 professors, ~7000 graduate students), which allows graduate students from other Canadian universities to be trained onsite and access 3IT equipment.