Grant: Idea to Innovation
Madden, John (The University of British Columbia)
$15,000.00
Soft, stretchable, multi-layer printed circuit board technology
FY 2017-18 · 2018-03-07
Summary
Flexible and stretchable electronics are desired so that sensing, computation and communication can be seemlessly integrated into clothing, onto the skin or even within the body. A major challenge has been the creation of printed circuit boards that are truly compliant. Recent published work has gone well beyond polyimide flex pcb technology, but depends on relatively high cost processes. In this market assessment we propose to explore the prospects for and impact of commercialization of a technology that uses low cost materials and existing fabrication tools to create flexible and stretchable printed circuit boards._x000D_
Program
Idea to Innovation
Location
British Columbia|Colombie-Britannique, Canada
Recipient Type
Academia
Type
Grant
Source
Proactive Disclosure - Grants and Contributions
As published
Additional Information
Grant or Award spanning more than one fiscal year (2017-2018 to 2018-2019).
Additional Information (French)
Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2018-2019).
Agreement Number
I2IPJ
Agreement Start Date
2018-03-07
Agreement Title
Soft, stretchable, multi-layer printed circuit board technology
Agreement Title (French)
Soft, stretchable, multi-layer printed circuit board technology
Agreement Type
Grant
Agreement Value
$15,000.00
Amendment Number
0
Organization Code
nserc-crsng
Organization
Natural Sciences and Engineering Research Council of Canada | Conseil de recherches en sciences naturelles et en génie du Canada
Program Name
Idea to Innovation
Program Name (French)
De l'idée à l'innovation
Program Purpose
Flexible and stretchable electronics are desired so that sensing, computation and communication can be seemlessly integrated into clothing, onto the skin or even within the body. A major challenge has been the creation of printed circuit boards that are truly compliant. Recent published work has gone well beyond polyimide flex pcb technology, but depends on relatively high cost processes. In this market assessment we propose to explore the prospects for and impact of commercialization of a technology that uses low cost materials and existing fabrication tools to create flexible and stretchable printed circuit boards._x000D_
Program Purpose (French)
Flexible and stretchable electronics are desired so that sensing, computation and communication can be seemlessly integrated into clothing, onto the skin or even within the body. A major challenge has been the creation of printed circuit boards that are truly compliant. Recent published work has gone well beyond polyimide flex pcb technology, but depends on relatively high cost processes. In this market assessment we propose to explore the prospects for and impact of commercialization of a technology that uses low cost materials and existing fabrication tools to create flexible and stretchable printed circuit boards._x000D_
Recipient City
British Columbia|Colombie-Britannique
Recipient Country
CA
Recipient Legal Name
Madden, John (The University of British Columbia)
Reference Number
GC-2017-Q4-01143
