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Grant: Applied Research and Development Grants - Level 1

Conestoga College Institute of Technology & Advanced Learning

$25,000.00

Connectem

EF 2021-22

Résumé
Addem Labs is an electronics development platform company who have developed a proprietary film that allows for the creation of copper Printed Circuit Boards (PCBs) with nothing more than traditional unmodified printers. This self-contained film replaces multiple processes in the production chain of circuit boards and enables users to prototype hardware in a matter of minutes, as opposed to the days or weeks that are currently required to build a prototype using traditional fabrication techniques. Working with Conestoga College, Addem Labs Inc. wants to create a web-based software platform for electronics engineers and engineering students to support the import of 3D models of electronics components for design, a task which is typically performed multiple times a day by design engineers. The project focus is on the creation of a new tool that allows for existing electronics-CAD (e-CAD) software to interface with Connectem, Addem Lab's novel e-CAD solution. Connectem utilizes a custom format for electronic design files. The proposed project will involve research and development to create front end UI, data parsing, data format conversion based on the source, as well as creating testing and evaluation software for the overall system that will integrate the design and development of Printed Circuit Boards using this new process.
Programme
Applied Research and Development Grants - Level 1
Emplacement
Ontario, Canada
Type de bénéficiaire
Other
Type
Grant
Source
NSERC's Awards Data

Tel que publié

Application id
566981-2021
Name nom
Gibbins, Tim
Department département
Cambridge Campus
Organization id
22147
Institution établissement
Conestoga College Institute of Technology & Advanced Learning
Province en
Ontario
Province fr
Ontario
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2021
Competition year année de concours
2021
Award amount
25000
Program id
CARD1
Program name en
Applied Research and Development Grants - Level 1
Program name fr
Subventions de recherche et développement appliquée - niveau 1
Group en
Research partnerships programs
Group fr
Programmes de partenariat
Committee code
1561
Committee name en
Applied Research and Development Grants
Committee name fr
Subventions de recherche et développement appliquée
Area of application code
802
Area of application group en
Information and communication services
Area of application group fr
Services d'information et de télécommunications
Area of application en
Information systems and technology
Area of application fr
Systèmes d'information et technologie de l'information
Research subject code
2506
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Electron devices
Research subject fr
Dispositifs électroniques
Installment
inst:1
Partie
1
Nb partie
1
Application title
Connectem
Keyword
NSERC
Application summary
Addem Labs is an electronics development platform company who have developed a proprietary film that allows for the creation of copper Printed Circuit Boards (PCBs) with nothing more than traditional unmodified printers. This self-contained film replaces multiple processes in the production chain of circuit boards and enables users to prototype hardware in a matter of minutes, as opposed to the days or weeks that are currently required to build a prototype using traditional fabrication techniques. Working with Conestoga College, Addem Labs Inc. wants to create a web-based software platform for electronics engineers and engineering students to support the import of 3D models of electronics components for design, a task which is typically performed multiple times a day by design engineers. The project focus is on the creation of a new tool that allows for existing electronics-CAD (e-CAD) software to interface with Connectem, Addem Lab's novel e-CAD solution. Connectem utilizes a custom format for electronic design files. The proposed project will involve research and development to create front end UI, data parsing, data format conversion based on the source, as well as creating testing and evaluation software for the overall system that will integrate the design and development of Printed Circuit Boards using this new process.