Grant: Collaborative Research and Development Grants
Dalhousie University
$51,046.00
Multiscale thermal management of electronic components and enclosures
EF 2014-15
Résumé
Electronic components are today found in nearly every advanced engineering system. Thermal management ofthese electronics is becoming one of the most challenging issues in advanced systems engineering and animportant subject in regard to overall systems performance. To complicate matter, these electronic systemsvary in size from the millimeter for transistor packages to the ten of meter for independent, integratedelectronics shelters. As a result of the multitude of scales, no ""one size fits all"" solution can be applied to solvethis important issue; independent, system specific solutions must be researched and engineered.The objective of this four year research program is to develop thermal management solutions at various scalesof electronic systems used by the industrial partner, and develop associated systems required for this thermalmanagement, i.e., liquid cooling systems and pumps. The research will be performed at the applicant's Lab ofApplied Multiphase Thermal Engineering (LAMTE) at Dalhousie University. Five high priority researchprojects were selected: i. Ruggedized Tesla Pump for Liquid Cooling in Adverse Conditions; ii. GalliumNitride (GaN) Transistor Cooling Improvement Strategies; iii. Innovative Liquid Cooling Method of EnclosedElectronic Power Systems; iv. Thermal and Energy Management of Large Scale Electronic Shelters; v. Effectsof Contact Surface Characteristics on Thermal Interface Materials (TIMs) Performance. In order to perform theresearch associated with these projects, and provide innovative solutions for the related thermal managementissues, a combination of experimental, numerical and analytical work will be needed and performed.This proposed research will benefit both the industrial partner and the Canadian electronics industry byproviding critical knowledge, methods and designs for increase thermal management of power electronics atvarious scale.
Programme
Collaborative Research and Development Grants
Bénéficiaire
Emplacement
Nova Scotia, Canada
Type de bénéficiaire
Academia
Type
Grant
Source
NSERC's Awards Data
Tel que publié
Application id
447483-2013
Name nom
Groulx, Dominic
Department département
Mechanical Engineering
Organization id
79
Institution établissement
Dalhousie University
Province en
Nova Scotia
Province fr
Nouvelle-Écosse
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2014
Competition year année de concours
2013
Award amount
51046
Program id
CRDPJ
Program name en
Collaborative Research and Development Grants
Program name fr
Subventions de recherche et développement coopérative
Group en
Research partnerships programs
Group fr
Programmes de partenariat
Committee code
96
Committee name en
RPP Internal Decision Cttee
Committee name fr
Cté de décision interne - PPR
Area of application code
513
Area of application group en
Manufacturing processes and products
Area of application group fr
Procédés et produits industriels
Area of application en
Electrical and electronic machinery and equipment (including computer hardware)
Area of application fr
Machinerie et équipement électriques et électroniques (y compris matériel informatique)
Research subject code
1804
Research subject group en
Chemical engineering
Research subject group fr
Génie chimique
Research subject en
Heat transfer
Research subject fr
Transfert de chaleur
Partie
2
Nb partie
4
Application title
Multiscale thermal management of electronic components and enclosures
Keyword
NSERC
Application summary
Electronic components are today found in nearly every advanced engineering system. Thermal management ofthese electronics is becoming one of the most challenging issues in advanced systems engineering and animportant subject in regard to overall systems performance. To complicate matter, these electronic systemsvary in size from the millimeter for transistor packages to the ten of meter for independent, integratedelectronics shelters. As a result of the multitude of scales, no ""one size fits all"" solution can be applied to solvethis important issue; independent, system specific solutions must be researched and engineered.The objective of this four year research program is to develop thermal management solutions at various scalesof electronic systems used by the industrial partner, and develop associated systems required for this thermalmanagement, i.e., liquid cooling systems and pumps. The research will be performed at the applicant's Lab ofApplied Multiphase Thermal Engineering (LAMTE) at Dalhousie University. Five high priority researchprojects were selected: i. Ruggedized Tesla Pump for Liquid Cooling in Adverse Conditions; ii. GalliumNitride (GaN) Transistor Cooling Improvement Strategies; iii. Innovative Liquid Cooling Method of EnclosedElectronic Power Systems; iv. Thermal and Energy Management of Large Scale Electronic Shelters; v. Effectsof Contact Surface Characteristics on Thermal Interface Materials (TIMs) Performance. In order to perform theresearch associated with these projects, and provide innovative solutions for the related thermal managementissues, a combination of experimental, numerical and analytical work will be needed and performed.This proposed research will benefit both the industrial partner and the Canadian electronics industry byproviding critical knowledge, methods and designs for increase thermal management of power electronics atvarious scale.