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Grant: Collaborative Research and Development Grants

Université de Sherbrooke

$622,917.00

Advanced back end processing for high breakdown voltage and low thermal resistance GaN power transistor

EF 2019-20

Résumé
Gallium Nitride (GaN) transistors are emerging as a powerful (literally) new technology to meet tomorrow's needs for high power switching devices. These new transistors use existing know-how in advanced III-V semiconductors, and offer significant performance advantages over conventional silicon-based solutions while being cost-competitive. However, they need to push the electrical and thermal boundaries by improving device design and packaging to deliver actual power performance closer to the theoretical capabilities, and demonstrating improved reliability. The team presenting this proposal combines an emerging global pioneer in commercial GaN transistor technology (Ottawa-based GaN Systems) and the highly-experienced, multidisciplinary research team at the Université de Sherbrooke. Together, the partners propose a systematic study of alternative processing technologies to enhance GaN Systems' competitive edge. Focussing on enhancement of design parameters critical to high power handling (e.g: thermal resistance, breakdown voltage), the Sherbrooke researchers will leverage their capabilities in materials deposition and wafer processing to identify the most effective solutions for future manufacture of cost-competitive devices. Novel to this study is an exploration of major performance enhancements using special post-fabrication back-end process steps on finished commercial foundry wafers, together with integrated drivers for high voltage operation. This would enable GaN Systems to source devices from multiple facilities around the globe, boosting the power performance with a ""made in Canada"" process step.Essential to the outcomes of this study will be an understanding of how degradation and failure mechanisms prevail in this unique wide-bandgap material. The combined forces of GaN Systems (for detailed understanding of device electrical and thermal parameters) with the materials, processing and analytical resources at Sherbrooke, position this study to support a Canada-led power device innovation.
Programme
Collaborative Research and Development Grants
Emplacement
Quebec, Canada
Type de bénéficiaire
Academia
Type
Grant
Source
NSERC's Awards Data

Tel que publié

Application id
497994-2016
Name nom
Maher, Hassan
Department département
Génie électrique et génie informatique
Organization id
68
Institution établissement
Université de Sherbrooke
Province en
Québec
Province fr
Québec
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2019
Competition year année de concours
2016
Award amount
622917
Program id
CRDPJ
Program name en
Collaborative Research and Development Grants
Program name fr
Subventions de recherche et développement coopérative
Group en
RESEARCH PARTNERSHIPS
Group fr
PARTENARIATS DE RECHERCHE
Committee code
141
Committee name en
University/Industry
Committee name fr
Universités/industrie
Area of application code
304
Area of application group en
Energy resources
Area of application group fr
Ressources d'énergie
Area of application en
Electrical energy
Area of application fr
Énergie électrique
Research subject code
2517
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Industrial and power electronics
Research subject fr
Électronique de puissance et électronique industrielle
Installment
inst:3 - 3
Partie
3
Nb partie
3
Application title
Advanced back end processing for high breakdown voltage and low thermal resistance GaN power transistor
Keyword
NSERC
Application summary
Gallium Nitride (GaN) transistors are emerging as a powerful (literally) new technology to meet tomorrow's needs for high power switching devices. These new transistors use existing know-how in advanced III-V semiconductors, and offer significant performance advantages over conventional silicon-based solutions while being cost-competitive. However, they need to push the electrical and thermal boundaries by improving device design and packaging to deliver actual power performance closer to the theoretical capabilities, and demonstrating improved reliability. The team presenting this proposal combines an emerging global pioneer in commercial GaN transistor technology (Ottawa-based GaN Systems) and the highly-experienced, multidisciplinary research team at the Université de Sherbrooke. Together, the partners propose a systematic study of alternative processing technologies to enhance GaN Systems' competitive edge. Focussing on enhancement of design parameters critical to high power handling (e.g: thermal resistance, breakdown voltage), the Sherbrooke researchers will leverage their capabilities in materials deposition and wafer processing to identify the most effective solutions for future manufacture of cost-competitive devices. Novel to this study is an exploration of major performance enhancements using special post-fabrication back-end process steps on finished commercial foundry wafers, together with integrated drivers for high voltage operation. This would enable GaN Systems to source devices from multiple facilities around the globe, boosting the power performance with a ""made in Canada"" process step.Essential to the outcomes of this study will be an understanding of how degradation and failure mechanisms prevail in this unique wide-bandgap material. The combined forces of GaN Systems (for detailed understanding of device electrical and thermal parameters) with the materials, processing and analytical resources at Sherbrooke, position this study to support a Canada-led power device innovation.