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Grant: Research Tools and Instruments - Category 1 (<$150,000)

University of Waterloo

$150,000.00

High Resolution Thermal Imaging System For Thermal Design, Validation, and Failure Analysis of High Performance Digital and Radio Frequency Integrated Circuits

EF 2014-15

Résumé
The growing complexity and continued emphasis on multi-functionality and speed in today's integrated circuits (IC) has led to exponentially increased transistor counts and shrinking device geometries. Consequently, power dissipation is rapidly increasing, leading to higher heat fluxes, higher temperatures and larger temperature gradients. Critically, power dissipation levels in high-performance digital and radio-frequency (RF) ICs are approaching the cooling limit. Such a ""thermal crisis"" imposes significant challenges on IC performance, reliability, cost and portability. Hence, the design of high performance ICs needs to shift from electric-centric to electro-thermal design processes where the thermal aspects are considered at an early stage of the design to ensure the anticipated performance and reliability. The requested thermal imaging system will enable electro-thermal research on high performance digital and RF ICs across different IC design stages: from semiconductor technology, circuit design and validation, to failure analysis. The proposed thermoreflectance-based (TR) imaging system, which is currently unavailable in any academic or private institution in Canada, offers unique capabilities for high spatial and time resolutions with accurate temperature measurement. This is essential for developing relevant electro-thermal models of semiconductor devices, thermal-aware IC design techniques, thermal validation methods, and thermal-related failure analysis techniques which are critical to the development of reliable, high performance digital and RF ICs using sub-micron semiconductor technologies. The requested equipment also provides an effective method for IC inspection and trouble shooting.The success of the planned research, which relies on the availability of the requested equipment, will put Canada in a globally competitive position in the strategic area of next generation high-speed computer and RF communication platforms. Canadian semiconductor, IC design and wireless communication industries will greatly benefit from both the research outcomes and the highly qualified personnel trained on the equipment.
Programme
Research Tools and Instruments - Category 1 (<$150,000)
Emplacement
Ontario, Canada
Type de bénéficiaire
Academia
Type
Grant
Source
NSERC's Awards Data

Tel que publié

Application id
472585-2015
Name nom
Wei, Lan
Department département
Electrical & Computer Engineering
Organization id
33
Institution établissement
University of Waterloo
Province en
Ontario
Province fr
Ontario
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2014
Competition year année de concours
2015
Award amount
150000
Program id
EQPEQ
Program name en
Research Tools and Instruments - Category 1 (<$150,000)
Program name fr
Outils et instruments de recherche - catégorie 1 (<150 000$)
Group en
Discovery grants programs
Group fr
Programmes de subventions à la découverte
Committee code
1510
Committee name en
Electrical and Computer Engineering
Committee name fr
Génie électrique et informatique
Area of application code
805
Area of application group en
Information and communication services
Area of application group fr
Services d'information et de télécommunications
Area of application en
Communications technologies (satellites, radar, etc.)
Area of application fr
Technologie des télécommunications (satellites, radar,etc.)
Research subject code
2504
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Integrated circuits
Research subject fr
Circuits intégrés
Partie
1
Nb partie
1
Application title
High Resolution Thermal Imaging System For Thermal Design, Validation, and Failure Analysis of High Performance Digital and Radio Frequency Integrated Circuits
Keyword
NSERC
Application summary
The growing complexity and continued emphasis on multi-functionality and speed in today's integrated circuits (IC) has led to exponentially increased transistor counts and shrinking device geometries. Consequently, power dissipation is rapidly increasing, leading to higher heat fluxes, higher temperatures and larger temperature gradients. Critically, power dissipation levels in high-performance digital and radio-frequency (RF) ICs are approaching the cooling limit. Such a ""thermal crisis"" imposes significant challenges on IC performance, reliability, cost and portability. Hence, the design of high performance ICs needs to shift from electric-centric to electro-thermal design processes where the thermal aspects are considered at an early stage of the design to ensure the anticipated performance and reliability. The requested thermal imaging system will enable electro-thermal research on high performance digital and RF ICs across different IC design stages: from semiconductor technology, circuit design and validation, to failure analysis. The proposed thermoreflectance-based (TR) imaging system, which is currently unavailable in any academic or private institution in Canada, offers unique capabilities for high spatial and time resolutions with accurate temperature measurement. This is essential for developing relevant electro-thermal models of semiconductor devices, thermal-aware IC design techniques, thermal validation methods, and thermal-related failure analysis techniques which are critical to the development of reliable, high performance digital and RF ICs using sub-micron semiconductor technologies. The requested equipment also provides an effective method for IC inspection and trouble shooting.The success of the planned research, which relies on the availability of the requested equipment, will put Canada in a globally competitive position in the strategic area of next generation high-speed computer and RF communication platforms. Canadian semiconductor, IC design and wireless communication industries will greatly benefit from both the research outcomes and the highly qualified personnel trained on the equipment.