Grant: Discovery Grants Program - Individual
Carleton University
$59,000.00
Advanced Machine Learning Based Modeling and Optimization Technologies for Design of High Frequency Electronic Components and Packages
EF 2023-24
Résumé
This project addresses the challenges in modeling and optimization of high-frequency electronic components and packages which are fundamental building blocks in next-generation wireless networks in communications, IoT and autonomous systems. The drive for more functionality, performance and bandwidth in these systems leads to more complex and stringent design requirements, necessitating the modeling of electromagnetic and multiphysics behavior in electronic components and packages while at the same time dealing with increasing dimensions of design parameter spaces. The subsequent challenges in next generation design easily overwhelm today's modeling and optimization capability. Built on top of our recent advances in neural network and neuro-space mapping technologies for radio frequency (RF)/microwave design, this research explores new frontiers in fast design automation algorithms for modeling, optimization, and knowledge-based design. New machine learning based methods employing deep learning for fast parametric models in wider input range and higher dimensional design spaces for electromagnetic and multiphysics design will be developed. New active learning methodologies with high-dimensional adaptive data sampling algorithms will be developed, reducing the cost of data generation for high-dimensional microwave modeling. Incorporating the knowledge of available semi-analytical/equivalent circuit models into different depths of deep learning structures, and exploiting the mapping relations between electromagnetic and multiphysics behaviors will lead to further advances to conquer the expense of parametric modeling in high-dimensional space. Many microwave design problems are inherently inverse of the simulation problem. New inverse modeling approaches will be developed to handle more complicated inverse relationships in high dimensional spaces, addressing non-uniqueness in inverse solutions with more design variables. A further investigation into electromagnetic topology optimization is planned by exploring quantum computing formulations of electromagnetic simulation and optimization, potentially conquering the prohibitive computations of electromagnetic topology optimization which requires exploration of huge design spaces. The long-term direction will be a new paradigm for modeling and optimization unifying knowledge-based design, and deep learning to perform high-frequency electronic design at much larger scale, much faster speed and much higher efficiency than possible today. The long-term impact will be smarter design methodology, faster design cycle, lower design cost, and better design quality. It contributes to creating new knowledge and training of highly qualified technical personnel in areas of high-frequency electronic design. Applications in designing RF/microwave/millimeter-wave circuits, and high-speed integrated circuits and packages also contribute to strengthening the competitiveness our high-tech economy.
Programme
Discovery Grants Program - Individual
Bénéficiaire
Emplacement
Ontario, Canada
Type de bénéficiaire
Academia
Type
Grant
Source
NSERC's Awards Data
Tel que publié
Application id
RGPIN-2023-05820
Name nom
Zhang, Qi-jun
Department département
Department of Electronics
Organization id
23
Institution établissement
Carleton University
Province en
Ontario
Province fr
Ontario
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2023
Competition year année de concours
2023
Award amount
59000
Program id
RGPIN
Program name en
Discovery Grants Program - Individual
Program name fr
Programme de subventions à la découverte - individuelles
Group en
DISCOVERY RESEARCH
Group fr
RECHERCHE AXÉE SUR LA DÉCOUVERTE
Committee code
1510
Committee name en
Electrical and Computer Engineering
Committee name fr
Génie électrique et informatique
Area of application code
1207
Area of application group en
Advancement of knowledge
Area of application group fr
Avancement des connaissances
Area of application en
Information, computer and communication technologies
Area of application fr
Technologie de l'information, des ordinateurs et des réseaux de communications
Research subject code
2506
Research subject group en
Electrical and electronic engineering
Research subject group fr
Electron devices
Research subject en
Génie électrique et électronique
Research subject fr
Dispositifs électroniques
Application title
Advanced Machine Learning Based Modeling and Optimization Technologies for Design of High Frequency Electronic Components and Packages
Keyword
artificial intelligence; electromagnetics; machine learning; microwave and millimeter-wave; microwave device modeling; microwave filters; modeling; neural networks; optimization; semiconductor devices
Application summary
This project addresses the challenges in modeling and optimization of high-frequency electronic components and packages which are fundamental building blocks in next-generation wireless networks in communications, IoT and autonomous systems. The drive for more functionality, performance and bandwidth in these systems leads to more complex and stringent design requirements, necessitating the modeling of electromagnetic and multiphysics behavior in electronic components and packages while at the same time dealing with increasing dimensions of design parameter spaces. The subsequent challenges in next generation design easily overwhelm today's modeling and optimization capability. Built on top of our recent advances in neural network and neuro-space mapping technologies for radio frequency (RF)/microwave design, this research explores new frontiers in fast design automation algorithms for modeling, optimization, and knowledge-based design. New machine learning based methods employing deep learning for fast parametric models in wider input range and higher dimensional design spaces for electromagnetic and multiphysics design will be developed. New active learning methodologies with high-dimensional adaptive data sampling algorithms will be developed, reducing the cost of data generation for high-dimensional microwave modeling. Incorporating the knowledge of available semi-analytical/equivalent circuit models into different depths of deep learning structures, and exploiting the mapping relations between electromagnetic and multiphysics behaviors will lead to further advances to conquer the expense of parametric modeling in high-dimensional space. Many microwave design problems are inherently inverse of the simulation problem. New inverse modeling approaches will be developed to handle more complicated inverse relationships in high dimensional spaces, addressing non-uniqueness in inverse solutions with more design variables. A further investigation into electromagnetic topology optimization is planned by exploring quantum computing formulations of electromagnetic simulation and optimization, potentially conquering the prohibitive computations of electromagnetic topology optimization which requires exploration of huge design spaces. The long-term direction will be a new paradigm for modeling and optimization unifying knowledge-based design, and deep learning to perform high-frequency electronic design at much larger scale, much faster speed and much higher efficiency than possible today. The long-term impact will be smarter design methodology, faster design cycle, lower design cost, and better design quality. It contributes to creating new knowledge and training of highly qualified technical personnel in areas of high-frequency electronic design. Applications in designing RF/microwave/millimeter-wave circuits, and high-speed integrated circuits and packages also contribute to strengthening the competitiveness our high-tech economy.