Grant: Idea to Innovation
Université de Sherbrooke
$125,000.00
Novel solder structures for high reliability flip chip applications - Scaling to high-density applications
EF 2021-22
Résumé
The proliferation of technology on our persons (smart phones, smart watches, medical monitoring) and within our modes of living (home assistants) and transportation (aided and autonomous driving) incite the microelectronics industry to develop systems that are increasingly powerful and reliable yet ever compact with lower power consumption and competitive cost. At the heart of these systems is the network of semiconductor chips that must connect with each other and to the outside world. Flip chip technology, using short, tiny (human hair size) metallic structures, is the leading edge means to effect such connections at the highest density and performance possible. Despite such capability, flip chip technology must continue to evolve in order to keep in step with system demands. Miniaturization is a key focal point. As densities increase and the structures are even tinier, it becomes more difficult to balance counteracting issues - solutions to maintain electrical integrity (using copper instead of solder, or changing the solder composition) come at the expense of mechanical integrity. Our invention resolves this balancing act by proposing a unique structure that actually changes during the overall flip chip interconnection process. An initially heterogeneous structure is produced using reasonable adaptations to the known manufacturing methods for producing solder interconnections. This structure increases mechanical resistance at critical points in the assembly process then changes before the end of assembly to create a final, homogeneous solder structure with optimized electrical properties for operation. We have demonstrated the structure and behavior at reasonably miniature geometries (150 micrometers) but recognize the need to scale down to the size (50 micrometers) required of future generations. We propose this project to evolve both the structure and its manufacturing methods to this smaller scale. Project success will enable a Canadian innovation to extend the reach of microelectronic interconnection technology.
Programme
Idea to Innovation
Bénéficiaire
Emplacement
Quebec, Canada
Type de bénéficiaire
Academia
Type
Grant
Source
NSERC's Awards Data
Tel que publié
Application id
567538-2021
Name nom
Danovitch, David
Department département
Génie électrique et génie informatique
Organization id
68
Institution établissement
Université de Sherbrooke
Province en
Québec
Province fr
Québec
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2021
Competition year année de concours
2021
Award amount
125000
Program id
I2IPJ
Program name en
Idea to Innovation
Program name fr
De l'idée à l'innovation
Group en
Research partnerships programs
Group fr
Programmes de partenariat
Committee code
96
Committee name en
RPP Internal Decision Cttee
Committee name fr
Cté de décision interne - PPR
Area of application code
513
Area of application group en
Manufacturing processes and products
Area of application group fr
Procédés et produits industriels
Area of application en
Electrical and electronic machinery and equipment (including computer hardware)
Area of application fr
Machinerie et équipement électriques et électroniques (y compris matériel informatique)
Research subject code
2519
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Microelectronics
Research subject fr
Microélectronique
Installment
inst:1
Partie
1
Nb partie
1
Application title
Novel solder structures for high reliability flip chip applications - Scaling to high-density applications
Keyword
NSERC
Application summary
The proliferation of technology on our persons (smart phones, smart watches, medical monitoring) and within our modes of living (home assistants) and transportation (aided and autonomous driving) incite the microelectronics industry to develop systems that are increasingly powerful and reliable yet ever compact with lower power consumption and competitive cost. At the heart of these systems is the network of semiconductor chips that must connect with each other and to the outside world. Flip chip technology, using short, tiny (human hair size) metallic structures, is the leading edge means to effect such connections at the highest density and performance possible. Despite such capability, flip chip technology must continue to evolve in order to keep in step with system demands. Miniaturization is a key focal point. As densities increase and the structures are even tinier, it becomes more difficult to balance counteracting issues - solutions to maintain electrical integrity (using copper instead of solder, or changing the solder composition) come at the expense of mechanical integrity. Our invention resolves this balancing act by proposing a unique structure that actually changes during the overall flip chip interconnection process. An initially heterogeneous structure is produced using reasonable adaptations to the known manufacturing methods for producing solder interconnections. This structure increases mechanical resistance at critical points in the assembly process then changes before the end of assembly to create a final, homogeneous solder structure with optimized electrical properties for operation. We have demonstrated the structure and behavior at reasonably miniature geometries (150 micrometers) but recognize the need to scale down to the size (50 micrometers) required of future generations. We propose this project to evolve both the structure and its manufacturing methods to this smaller scale. Project success will enable a Canadian innovation to extend the reach of microelectronic interconnection technology.
