Contribution: Industrial Research Assistance Program – Contributions to Firms
Ranovus Inc.
$2,000,000.00
3D packaging technologies for high capacity interconnect
EF 2018-19 · 2018-08-01
Résumé
The current packaging technologies use a 2 dimensional approach where by the components are laid out on a 2 dimensional substrate and each component is connected to the adjacent component using traditional wirebonds and optical lenses. This approach worked well for low capacity components, however as the speeds go beyond 50Gb/s per lane, the capacities grow beyond 400Gb/s per module and the real-estate for such functionality shrinks, the packaging needs to move into 3D and the designs need to be matched to gain optimum yield and tolerance to process variations.
Ministère
Programme
Industrial Research Assistance Program – Contributions to FirmsIndustrial Research Assistance Program-Contributions to Firms (lien de confiance élevée)
Bénéficiaire
Emplacement
Ottawa|Ottawa, Ontario, Canada
Type de bénéficiaire
For-profit organization
Numéro d'entreprise
826931883
Type
Contribution
Source
Proactive Disclosure - Grants and Contributions
Tel que publié
Agreement End Date
2020-02-28
Agreement Number
911938
Agreement Start Date
2018-08-01
Agreement Title
3D packaging technologies for high capacity interconnect
Agreement Title (French)
Technologies d'emballage 3D pour une interconnexion à haute capacité
Agreement Type
Contribution
Agreement Value
$2,000,000.00
Amendment Number
0
Coverage
IRAP Contributions to Firms projects stimulate wealth creation for Canada through technological innovation. | Les projets des Contributions aux entreprises stimulent la création de richesse au Canada grâce à l’innovation technologique.
Description
The current packaging technologies use a 2 dimensional approach where by the components are laid out on a 2 dimensional substrate and each component is connected to the adjacent component using traditional wirebonds and optical lenses. This approach worked well for low capacity components, however as the speeds go beyond 50Gb/s per lane, the capacities grow beyond 400Gb/s per module and the real-estate for such functionality shrinks, the packaging needs to move into 3D and the designs need to be matched to gain optimum yield and tolerance to process variations.
Description (French)
Les technologies d'emballage actuelles utilisent une approche bidimensionnelle où les composants sont disposés sur un substrat bidimensionnel et chaque composant est connecté au composant adjacent à l'aide de fils de liaison traditionnels et de lentilles optiques. Cette approche a bien fonctionné pour les composants à faible capacité, mais comme les vitesses dépassent 50 Gb / s par voie, les capacités augmentent au-delà de 400 Gb / s par module et l'espace pour cette fonctionnalité se réduit. L'emballage doit être adapté à une capacité 3D et les conceptions doivent correspondre pour obtenir un rendement et une tolérance optimaux aux variations du processus.
Expected Results
The purpose of IRAP Contributions to Firms is to support research, development, adoption and/or adaptation of innovative or technology-driven new or improved products, services or processes in Canada up to their commercialization
Expected Results (French)
Le PARI, par le biais des Contributions aux entreprises, vise à appuyer la recherche, le développement, l’adaptation et/ou l’adoption au Canada de produits, de services ou de processus novateurs ou axés sur des technologies nouvelles ou améliorées, et ce jusqu’à leur commercialisation
Federal Riding
Nepean
Federal Riding (French)
Nepean
Federal Riding Number
35064
NAICS Code
334290
Organization Code
nrc-cnrc
Organization
National Research Council Canada | Conseil national de recherches Canada
Program Name
Industrial Research Assistance Program – Contributions to Firms
Program Name (French)
Programme d’aide à la recherche industrielle – Contributions aux entreprises
Program Purpose
The purpose of IRAP Contributions to Firms is to support research, development, adoption and/or adaptation of innovative or technology-driven new or improved products, services or processes in Canada up to their commercialization
Program Purpose (French)
Le PARI, par le biais des Contributions aux entreprises, vise à appuyer la recherche, le développement, l’adaptation et/ou l’adoption au Canada de produits, de services ou de processus novateurs ou axés sur des technologies nouvelles ou améliorées, et ce jusqu’à leur commercialisation
Recipient Business Number
826931883
Recipient City
Ottawa|Ottawa
Recipient Country
CA
Recipient Legal Name
Ranovus Inc.
Recipient Postal Code
K2H 8R6
Recipient Province or Territory
ON
Recipient Type
F
Reference Number
172-2018-2019-Q2-911938
