Grant: Alliance Grants

Global transition to a digital society has billions using microelectronic technology in their day-to-day activities. The increasing demand for miniaturization, speed, and reliability must be satisfied with a compact combination of multiple microchips. The technical constraints are quickly surpassing the capabilities of conventional circuit boards. Thus, silicon interposers, a high-cost, high-performance packaging solution for integrating multiple kinds of chips, have gained popularity in research and commercialization. This proposal will develop and prove the first low-cost, accessible silicon interposer technology made-in-Canada. The proposal team, involving investigators from Université de Sherbrooke, Polytechnique Montréal, Université Laval, and University of Toronto and industry partners CMC Microsystems, SBQuantum, and Xanadu, will develop ultra-compact systems on interposer to advance the state of the art in biomedical sensing and quantum technology. As a result of this project, an established Canadian supply chain for interposers, involving national innovation facilities and university labs, will continue delivering this critical tool to enable the growing digital economy and to boost international competitiveness for over 10,000 microsystems developers in Canada.