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Grant: Strategic Projects - Group

University of Waterloo

$199,000.00

High resolution, hard X-ray digital imagers for non-destructive testing applications

EF 2016-17

Résumé
Our proposed Strategic Partnership Grant will lead to the development of new high-performance image sensors for cabinet digital X-ray systems that will significantly benefit Canada's manufacturing sector. X-ray cabinet systems are turnkey devices normally comprising an X-ray source, sample stage, and X-ray detector all housed in a shielded enclosure. The portability, performance, and cost of these systems make them attractive for use in non-destructive test (NDT) applications where intact products in a manufacturing environment are inspected for micrometre-scale internal defects. By combining X-ray-sensitive amorphous semiconductor materials such as amorphous selenium with complementary metal-oxide-semiconductor (CMOS) integrated pixel arrays, we will create X-ray inspection and measurement technology that will provide better resolution, recognition, accuracy, and speed of data capture compared to existing technologies used for NDT. These improvements will enhance productivity and quality control in processes used by Canadian automotive, aerospace, and electronic device manufacturers that rely on 2-D and 3-D NDT for integrity verification, failure analysis, process validation, and prototype evaluation. This project is being carried out in collaboration with Teledyne DALSA (T-DALSA), a Canadian company with headquarters in Waterloo, ON and that has design and manufacturing centers across Canada. Our research involves training graduate engineering students in the manufacturing and information technology industries. Such highly-qualified personnel (HQP) are essential to maintaining Canada's technological advantage globally.
Programme
Strategic Projects - Group
Emplacement
Ontario, Canada
Type de bénéficiaire
Academia
Type
Grant
Source
NSERC's Awards Data

Tel que publié

Application id
479172-2015
Name nom
Karim, KarimSallaudin
Department département
Electrical & Computer Engineering
Organization id
33
Institution établissement
University of Waterloo
Province en
Ontario
Province fr
Ontario
Country en
CANADA
Country fr
CANADA
Fiscal year exercice financier
2016
Competition year année de concours
2015
Award amount
199000
Program id
STPGP
Program name en
Strategic Projects - Group
Program name fr
Projets stratégiques - De groupe
Group en
Research partnerships programs
Group fr
Programmes de partenariat
Committee code
1569
Committee name en
Strategic Projects Selection Panel - Manufacturing
Committee name fr
Comité de sélection des projets stratégiques - Fabrication
Area of application code
500
Area of application group en
Manufacturing processes and products
Area of application group fr
Procédés et produits industriels
Area of application en
Manufacturing processes and products
Area of application fr
Procédés et produits industriels
Research subject code
2523
Research subject group en
Electrical and electronic engineering
Research subject group fr
Génie électrique et électronique
Research subject en
Semiconductor fabrication and packaging
Research subject fr
Fabrication et mise sous enveloppe de semi-conducteurs
Partie
2
Nb partie
3
Application title
High resolution, hard X-ray digital imagers for non-destructive testing applications
Keyword
NSERC
Application summary
Our proposed Strategic Partnership Grant will lead to the development of new high-performance image sensors for cabinet digital X-ray systems that will significantly benefit Canada's manufacturing sector. X-ray cabinet systems are turnkey devices normally comprising an X-ray source, sample stage, and X-ray detector all housed in a shielded enclosure. The portability, performance, and cost of these systems make them attractive for use in non-destructive test (NDT) applications where intact products in a manufacturing environment are inspected for micrometre-scale internal defects. By combining X-ray-sensitive amorphous semiconductor materials such as amorphous selenium with complementary metal-oxide-semiconductor (CMOS) integrated pixel arrays, we will create X-ray inspection and measurement technology that will provide better resolution, recognition, accuracy, and speed of data capture compared to existing technologies used for NDT. These improvements will enhance productivity and quality control in processes used by Canadian automotive, aerospace, and electronic device manufacturers that rely on 2-D and 3-D NDT for integrity verification, failure analysis, process validation, and prototype evaluation. This project is being carried out in collaboration with Teledyne DALSA (T-DALSA), a Canadian company with headquarters in Waterloo, ON and that has design and manufacturing centers across Canada. Our research involves training graduate engineering students in the manufacturing and information technology industries. Such highly-qualified personnel (HQP) are essential to maintaining Canada's technological advantage globally.