Grant: Idea to Innovation

This project focus on the prototyping phase of a new Micro-Electro-Mechanical-System (MEMS)-based sensor for 3D stress/strain measurements intended for Structural Health Remote Monitoring (SHM) applications. The verified sensing mechanism utilizes silicon piezoresistive elements to construct a micro sensing chip that can monitor the 3D stresses and strains on a strained structure surface. A micro assembly flip chip technique is utilized to construct this SHRM chip using electronic circuitry, telemetry system, and power source into one micro-packaged sensory chip that can communicate wirelessly with a remote monitoring station. This structural health remote monitoring (SHRM) technology adds many benefits to the micro strain gauges currently available in the market. The MEMS strain sensor (1) is CMOS compatible for fine pitch integration with wireless and data processing circuitry, (2) operates with durable lower power consumption (1-50mW), (3) is able to sense with enhanced far/near field strain ratio and (4) has a unique capability of 3D stress/strain extraction to monitor out-of-plane stresses responsible for sensor de-bonding. The initial concept of the proposed MEMS- based strain sensory technique has been verified analytically and experimentally. This I2I phase I proposal will focus on preparing a prototype that can be used for beta field testing the sensory chip. With the success of this phase, we plan to move forward with our commercialization plan through Phase II. The sensory chip will be commercialized through a company spin-off in collaboration with the university commercialization office. With a wide potential market, where several industrial parties has expressed their interest and support in deploying the MEMS stress sensor on their oil sands mining equipment and strain measurement systems in Alberta.