Grant: Collaborative Research and Development Grants

This project addresses the challenges in designing high-speed electronic packages which are fundamental building blocks in next-generation networks such as 5G wireless networks, and IoT networks. As the signal speed in the electronic devices and packages continue to increase as demanded by the next generation networks, the electromagnetic effects in the electronic packages become significant. Electromagnetic based design and optimization become necessary. Significant research progress over the past two decades has made electromagnetic simulation nowadays widely used in the analysis and verification of high-speed/high-frequency electronic design. However, electromagnetic optimization is still challenging and computationally expensive due to the need of highly repetitive electromagnetic simulations with repetitive changes in physical/geometrical parameters. This research addresses such challenges, and develops new methods for electromagnetic parametric modeling and optimization of high-speed packages. The parametric models will allow quick evaluation of electromagnetic behavior with respect to changes in physical/geometrical variables. The optimization algorithm will automatically adjust the physical/geometrical parameters to achieve optimal electromagnetic behavior of the high-speed packages. Our methods will exploit engineering knowledge of the packages and combine them with advanced computational algorithms for fast and accurate modeling and optimization. This work will help designers in the high-speed package industry to achieve better design solutions in shorter time, increase design efficiency, and speedup design cycle. It elevates the state of the art of electromagnetic modeling and optimization technology, and trains highly qualified technical personnel for the Canadian information and communication technology sector. *